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This is a low viscosity hot melt used for assembly or in end of line packaging. It is typically used to laminate foil to expanded polystyrene and to produce spring pockets in the bedding industry. This adhesive has excellent adhesive capabilities with a wide range of substrates. It creates a moisture and water-resistant bond and has a high resistance to low and high temperatures.
This hot melt can be applied by nozzle, disc application and slot coater.
It exhibits good thermal stability and has a wide window of heat and freezer bond resistance.
As it is a flexible product, it has good bonding performance at very low temperatures.
This adhesive has a low viscosity for pocket spring applications.
It is food industry compliant with FDA 175.105 Indirect Food Contact Approval.